IISc Scientists Propose World’s Smallest Angstrom-Scale Chips

In a groundbreaking move that could catapult India into the top ranks of global semiconductor innovation, a team of 30 scientists from the Indian Institute of Science (IISc), Bengaluru, has proposed a futuristic initiative: the development of angstrom-scale semiconductor chips. These chips, if successfully developed, would be nearly ten times smaller than the most advanced 3-nanometre chips available today—setting a new global benchmark in miniaturization and technology.

At the heart of this bold proposal lies a mission to move beyond conventional silicon-based technologies and embrace novel two-dimensional (2D) materials, like graphene and transition metal dichalcogenides (TMDs). These atom-thin materials exhibit exceptional electrical and thermal properties and are poised to become the building blocks of the next generation of computing devices.

Currently, global tech giants such as Samsung and TSMC manufacture chips at the 3-nanometre scale. However, the IISc team envisions developing chips at the angstrom scale, where one angstrom equals just 0.1 nanometres. This ultra-miniaturization would not only revolutionize performance but also drastically reduce energy consumption and heat generation—two of the most critical challenges in modern electronics.

To bring this vision to life, the IISc scientists have requested ₹500 crore in funding spread over five years. Compared to India’s ongoing ₹91,000 crore semiconductor projects, this is a relatively small investment with potentially massive returns. Importantly, the plan includes a roadmap to make the initiative self-sustainable after the initial government support period.

This proposal was first submitted to the office of the Principal Scientific Adviser in April 2022 and later revised in October 2024. It has garnered interest from key government entities, including the Ministry of Electronics and IT (MeitY), NITI Aayog, DRDO, and the Department of Space. Discussions are ongoing at high levels to explore its implementation and possible applications.

What makes this initiative revolutionary is its emphasis on 2D materials, which could bypass the physical limitations that are now slowing down the progress of silicon-based chips. Materials like graphene—a single layer of carbon atoms—and TMDs offer direct bandgaps, high electron mobility, and superior thermal conductivity. They are ideally suited for creating ultra-small, energy-efficient, and high-speed chips.

Globally, the race to harness the power of 2D semiconductors is heating up. Europe has invested over $1 billion in this domain, South Korea more than $300 million, and China and Japan are making rapid strides. Leading universities and research institutions around the world are exploring this frontier technology. Yet, India’s efforts in this space remain limited, and this project offers a rare window to take the lead before the opportunity closes.

Beyond reducing dependence on foreign semiconductor imports, the successful execution of this project could usher in a new era of technological independence for India. It could also spark innovation across sectors like healthcare, space technology, wearable electronics, and artificial intelligence. Angstrom-scale chips would not just make devices smaller—they could redefine what’s possible in electronics.

The proposal also brings with it an opportunity to create high-value jobs, attract international collaboration, and build a new ecosystem focused on advanced material science and chip fabrication. However, experts warn that time is critical. The global momentum toward 2D semiconductors is accelerating, and India needs to act swiftly to seize its moment.

Despite receiving encouraging responses, the project still awaits formal approval and funding. To succeed, it will require a coordinated effort among policymakers, scientists, and industry players. Infrastructure, skills, and partnerships must be developed to translate lab-scale innovations into commercial products.

In conclusion, India stands at the cusp of a historic opportunity. The IISc’s angstrom-scale chip proposal is not just about developing smaller chips—it’s about reshaping the future of technology. If implemented decisively, it could mark India's arrival as a leader in post-silicon semiconductor innovation, opening the door to a new era of electronics powered by 2D materials. The time to act is now.